congatec at the ESEC 2017 trade show

The ESEC in Tokyo is the largest IT trade show in Japan. congatec spotlights its new high-end embedded computing portfolio for robotics and real-time automation. One highlight of the ESEC showcase is the quick boot demo based on congatec’s new Qseven conga-UMX6 computer-on-module with NXP’s (former Freescale) i.MX6 processors. i.MX6 processors enable a highly customizable quick boot of systems in a second from power off to full operation including running applications. Also brand new and impressive is the new SMARC 2.0 computer-on-module demonstration based on of Intel Atom, Celeron and Pentium processors (codename Apollo Lake) where congatec presents the implementation of fully featured USB Type C connectivity with USB 3.1 Gen1, power and graphics. A highlight for the high-end embedded and edge sever sectors are the new COM Express Type 7 based server-on-modules offering server-grade performance and functionality with their Intel Xeon D processors, 2x 10 GbE and 32 PCIe lanes. The latter can be used for powerful intra system expansions such as GPGUs and NVMe based ultra-fast storage devices as well as multi-module configurations on one single carrier board for high performance computing (HPC) designs. Application areas for the server-on-modules can be found in various scenarios from IT and carrier-grade server farms and cloudlets to edge, fog and Industry 4.0 servers.